• India’s #1 University and
    Research Institute*
  • 9 Months Executive Friendly
    Programme
  • 180 Hours Immersive
    Learning
  • 5 Days Campus Visit
    at IISc

*NIRF 2023

This is the decade of
Semiconductors

  • "Tata Electronics and PSMC will build India's first state-of-the-art Fab unit in Dholera with a total investment of ₹91,000 Crores." 1
  • "Samsung launched a semiconductor R&D facility in India to drive cutting-edge semiconductor research and development in the country." 2
  • "With the approval of four projects, our combined production capacity will be 80 million chips per day, and with these, electronics manufacturing will jump from $105 billion to $300 billion in the coming years." 3
    - Ministry of Electronics & Information Technology
  • "The demand for semiconductor jobs is on rise considering expansion plans of companies like Kaynes Technology, Micron Technology, and SRAM & MRAM Technologies contributing to 12000+ new Jobs confirming the surge in opportunities." 4

Applications Open

91-9059880579

Most sought-after expertise in the VLSI - Semiconductor Industry

Top roles for certified semiconductor
technology professionals

  • Device Design Engineer
  • Test and Characterization Engineer
  • Process Engineer
  • TCAD Engineer
  • Tapeout engineer
  • Foundry process design Engineer
  • Integration engineer
  • Yield analysis engineer
  • ESD design technical manager
  • EBO engineer
  • Wet clean process manager
  • Etch process manager
  • Litho/EUV module engineer
  • EUV mask materials scientist
  • Layout design and validation Engineer
  • CMP engineer Epitaxy process manager
  • EUV tool manager
  • Litho/Patterning process manager
  • Electrochemical plating module engineering manager
  • Advanced packaging material development manager
  • Memory circuit design engineer
  • Digital/Mixed-Signal IC design engineer
  • RF Analog Engineer/RFIC Circuit design engineer
  • Automated test and characterization engineer
  • PVD module manager
  • I/O design engineer
  • Analog/Power delivery engineer
  • CAD Physical verification engineer
  • Patent technical manager
  • CSV engineer (Virtual Fab)
  • And many more

IISc Edge

IISc (Indian Institute of Science) is the oldest and the finest higher education institute of its kind in India. It pursues excellence in research and education in several fields of Science and Engineering. It is one of the first three publicly funded institutes to be awarded the Institute of Eminence status. The alumni of IISc hold significant academic and industry positions around the globe. For more information, https://www.iisc.ac.in/.

The PG Level Advanced Certificate Programme in Microelectronics and Semiconductor Technologies will be delivered by IISc’s Centre for Continuing Education (CCE). CCE offers courses suitably designed to meet the requirements of various target groups - research & development (R&D) laboratories and industries, research scientists, and engineers- enabling them to grow into competent managers of technology-intensive and data-driven organisations. For more information, visit http://cce.iisc.ac.in

Expert Faculty

Taught by eminent IISc Faculty

Programme Director
Prof. Mayank Shrivastava

Award Winning Scientist | Author of 225+ Research Publications and 55+ Patents



Associate Professor, Department of Electronic Systems Engineering, IISc and Co-Founder - AGNIT Semiconductors Pvt. Ltd

Research Expertise: VLSI – Nanoelectronics, Semiconductor Device Design, Modeling & Characterisation, Nanotechnology, On-chip ESD Protection, Analog Memory for Neuromorphic Applications

  • Co-founded AGNIT Semiconductors, a deeptech startup working on next-generation Gallium Nitride (GaN) semiconductors
  • Worked with leading organisations like IBM Microelectronics (USA), Intel Mobile Communications (USA) and Intel Corp. (Germany) and Infineon Technologies (USA and Germany)
  • Won several young scientist awards that include Platinum Jubilee Award (NASI), INSA, MIT’s Outstanding Innovator Award (TR35), and more
  • Authored 200+ research papers. Holds 40+ patents; most are either licensed by semiconductor companies or are in use in their products
  • Editor for IEEE Transactions on Electron Devices & Also a recipient of Vasavic Award
  • He is also an Investigator for Gallium Nitride Ecosystem Enabling Centre & Incubator (GEECI), MeitY-GoI
  • Swarna Jayanti Fellowship, DST, 2021 – 2026
  • Abdul Kalam Technology Innovation National Fellowship, INAE, 2021 – 2026
  • Leading the National Future Technology Initiative Using 2D Semiconductors

Curriculum

Leverage a state-of-the-art curriculum, designed by IISc Faculty and gain an insight into the device design, modeling, characterisation and development of semiconductor technology.

PG Level Advanced Certification Programme - 9 Months

  • Introduction to semiconductor device physics
  • Carrier statics and dynamics
  • Semiconductor Junctions
  • Ideal and non-ideal MOS capacitor
  • MOSFETs

Learning Outcomes

  • Understand the fundamental properties of semiconductors and how it is different from insulators and conductors.
  • Understand the evolution of semiconductors, possible developments, and avenues for research/development in this field.
  • Correlate the findings of quantum mechanics with the semiconductors. Solving Schrodinger wave equation under classical conditions. Understanding relevance of energy-momentum diagrams and its application in understanding semiconductor devices.
  • Estimate the free carrier density in semiconductors by utilizing concepts like density of states, and Fermi Dirac statistics.
  • Understand the charge transport mechanisms in semiconductors.
  • Solve the fundamental equations required to derive characteristics of any semiconductor device. These equations include Poisson’s equation, electron and hole continuity equations, and minority carrier diffusion equations.
  • Draw energy band diagrams of basic semiconductor devices including p-n junction diodes, and Metal Semiconductor junctions.
  • Derive current voltage relationships of p-n junction and metal-semiconductor junction systems.
  • Understand non-idealities in p-n junction diode operation and other similar devices.

  • Overview: Basics of Transistor scaling, VLSI Technology, Moore’s Law, ITRS, CMOS, BiCMOS, BCD and Other technologies, etc.
  • Cleanroom Basics
  • Semiconductor Process such as Oxidation, Diffusion, thin film deposition, Ion Implantation, Lithography, etching.
  • Non-CMOS Processes and other process modules
  • Process Flow: CMOS process flow & LDMOS process flow and process integration challenges
  • Process – Device co-design
  • Assignments/Lab: Process TCAD Modules

Learning Outcomes

  • Identify the challenges associated with reducing the size of semiconductor devices.
  • Identify the requirements for fabricating semiconductor devices. Students will learn about the requirement of clean rooms, different classes of clean rooms and basic processes related to cleaning of semiconductor wafers.
  • Understand different processes for growing silicon crystals that are used for semiconductor device fabrications.
  • Understand different processes related to semiconductor device fabrication, including, different methods of oxidation, diffusion, thin film deposition, ion-implantation, lithography and etching.
  • Understand the complete process flow for the complementary MOS technology, which is the driving force of very large scale integration (VLSI) technology.
  • Understand the implications of different process steps on device operation.
  • The importance of process-device co-design in terms of performance and reliability of the device.

  • Digital
  • Analog
  • Radio Frequency (RF)

Learning Outcomes

  • Gain basic understanding of both digital and analog VLSI design.
  • This includes understanding the basic design approaches to implement a digital or analog operation in VLSI technology.
  • Understand the impact of device design on performance of the VLSI circuits.

  • The Ideal MOS Capacitor
  • The Non-Ideal MOS Capacitor
  • The MOS Capacitor as a Diagnostic Device
  • The Long Channel MOSFET
  • The Short Channel MOSFET
  • Double Gate MOSFET and FinFETs

Learning Outcomes

  • Understand different modes of operation of a metal-oxide-semiconductor (MOS) system.
  • Draw and understand the energy band diagram MOS system under different bias arrangements.
  • Extend the understanding of MOS capacitors to realize MOS field effect transistors (MOSFETs).
  • Derive current voltage relationships of n-channel and p-channel MOSFETs.
  • Understand the challenges associated with reducing the size of MOSFETS.
  • Understand the operating principle of bipolar junction transistors, draw their energy band diagram, minority and majority carrier concentrations and the process of carrier transport.
  • Understand the semiconductor device operation in photo regime, including light emitting diodes as well as photo detectors.
  • Understand design principle and operation of advanced architectures like fin gated FETs, and nanowire FETs.
  • Understand the operating principle of next generation device technologies, including, graphene and carbon nanotube based FETs, and 2-D material based transistors. Students will be able to link the material physics to transistor design.

  • Carrier transport and carrier energy fundamentals, avalanche multiplication and breakdown, hot carrier induced (HCI) degradation mechanism, NBTI/PBTI, TDDB, GOI and Electromigration.
  • ESD and latch-up phenomena, Test models and methods, ESD protection devices and device physics, Advance ESD protection devices, high current effects and filaments, Negative differential resistance, Physics of ESD failure.
  • ESD protection methodology, ESD protection circuits, ESD protection for Analogue/RF and mixed-signal modules, General rules for ESD design, layout considerations for ESD and latch-up protection, understanding parasitic.
  • ESD circuit simulation basics and requirements, ESD TCAD simulation methodology.
  • System on Chip overview and system ESD aspects, case studies related to product failures and solutions use
  • High current injection, High field effects, Negative differential resistance and Current filaments, Drain extended MOS devices and associated week ESD robustness. ESD behaviour of FinFET devices, SiGe-FETs and other quantum well devices, Impact of stress & strain on ESD behaviour, ESD devices in advanced CMOS and BiCMOS technology, Impact of technology scaling on ESD behaviour, Special analogue and RF ESD protection devices and circuits. Impact of ESD stress on CNTs, Graphene and other 2D material-based Nanoelectronic devices. ESD Device modelling for circuit simulations, State-of-the-art on CDM ESD protection, CDM tester models, modelling CDM behaviour and CDM simulations, ESD verification flow and methodology, Towards full chip ESD simulation, Transient latch-up, System-level ESD, System Efficient ESD design (SEED), Case studies.

Learning Outcomes

  • The participants will able to develop basic understanding related to the Electrostatic Discharge (ESD) phenomenon and able to understand how ESD impacts the reliability of the semiconductor devices. At the end of these module they also know how IC can be damaged with the ESD.
  • The participants will be able to know what are different kind of ESD that leads to impact the reliability of the semiconductor devices and what are its associated models and these models behaves.
  • The participants will be able to know different protection concept in device level, circuit level as well as system level. They also will be able to develop the understanding for Layout consideration related to ESD event.
  • At the end of this module, the participants will be able to answer how the basic semiconductor devices like; resistor, diode, MOSFET and SCR responds to ESD event and why these devices will be useful to design as an ESD protection element.
  • The participants will also be able to validate their understanding of the device physics of ESD protection elements by performing the TCAD simulations.

  • Power device applications
  • Semiconductor Physics under extreme conditions
  • Power Diodes
  • Si High Power MOS devices, design and Technology
  • GaN Power HEMTs
  • Power Device Design Lab

Learning Outcomes

  • The participants will be able to develop the basic understanding related to power semiconductor device, how these devices have been developed with time and its play an important role in the semiconductor industry.
  • They will be able to know the basic design schemes of the power semiconductor devices like power diode, power MOSFET.
  • They will also able to know how materials property can impacts the power device performance with the help of GaN HEMT.
  • The participants will also be able to validate their understanding of the power device physics by performing the TCAD simulations of the basic devices

  • Device TCAD and Device Design Basics using TCAD
  • CMOS Process Technology, Process Development, Integration and Simulation
  • Semiconductor Device Characterization
  • Library / PDK Development
  • Includes hands-on projects at MSDLab during 5-day visit to IISc campus

Learning Outcomes

  • The participants will be able to know the device simulation using industry standard TCAD tool and relate the theoretical concepts with the help of simulation experiments. They will also be able to answer the importance of the TCAD tool for device designing.
  • They will be able to perform basic 2D simulation of the basic devices like Resistor, Diode, MOSFET.
  • At the end of this module, the participants will also be able know the process recipe to fabricate basic device structures. They will be able to know the realization of the semiconductor devices using basic process steps like; depositing oxide screening, implantation and annealing.
  • With the help of lab, they will be able to analyse the charge transport phenomenon to develop device level understanding and how these charge transports impacts on the electrical characteristics of the devices.
  • At the end they will be able to do circuit simulation with the semiconductor devices using MIXMODE simulation, where they can relate how NMOS and PMOS can be design in device level to get the optimum characteristics of the inverter.
  • They will also be able to taste the real scenario of the semiconductor devices. How these devices can be fabricated and characterized in Lab by visiting at MSD’s Lab, IISc.

Advanced Certification Programme - 6 Months

  • Introduction to semiconductor device physics
  • Carrier statics and dynamics
  • Semiconductor Junctions
  • Ideal and non-ideal MOS capacitor
  • MOSFETs

Learning Outcomes

  • Understand the fundamental properties of semiconductors and how it is different from insulators and conductors.
  • Understand the evolution of semiconductors, possible developments, and avenues for research/development in this field.
  • Correlate the findings of quantum mechanics with the semiconductors. Solving Schrodinger wave equation under classical conditions. Understanding relevance of energy-momentum diagrams and its application in understanding semiconductor devices.
  • Estimate the free carrier density in semiconductors by utilizing concepts like density of states, and Fermi Dirac statistics.
  • Understand the charge transport mechanisms in semiconductors.
  • Solve the fundamental equations required to derive characteristics of any semiconductor device. These equations include Poisson’s equation, electron and hole continuity equations, and minority carrier diffusion equations.
  • Draw energy band diagrams of basic semiconductor devices including p-n junction diodes, and Metal Semiconductor junctions.
  • Derive current voltage relationships of p-n junction and metal-semiconductor junction systems.
  • Understand non-idealities in p-n junction diode operation and other similar devices.

  • Overview: Basics of Transistor scaling, VLSI Technology, Moore’s Law, ITRS, CMOS, BiCMOS, BCD and Other technologies, etc.
  • Cleanroom Basics
  • Semiconductor Process such as Oxidation, Diffusion, thin film deposition, Ion Implantation, Lithography, etching.
  • Non-CMOS Processes and other process modules
  • Process Flow: CMOS process flow & LDMOS process flow and process integration challenges
  • Process – Device co-design
  • Assignments/Lab: Process TCAD Modules

Learning Outcomes

  • Identify the challenges associated with reducing the size of semiconductor devices.
  • Identify the requirements for fabricating semiconductor devices. Students will learn about the requirement of clean rooms, different classes of clean rooms and basic processes related to cleaning of semiconductor wafers.
  • Understand different processes for growing silicon crystals that are used for semiconductor device fabrications.
  • Understand different processes related to semiconductor device fabrication, including, different methods of oxidation, diffusion, thin film deposition, ion-implantation, lithography and etching.
  • Understand the complete process flow for the complementary MOS technology, which is the driving force of very large scale integration (VLSI) technology.
  • Understand the implications of different process steps on device operation.
  • The importance of process-device co-design in terms of performance and reliability of the device.

  • The Ideal MOS Capacitor
  • The Non-Ideal MOS Capacitor
  • The MOS Capacitor as a Diagnostic Device
  • The Long Channel MOSFET
  • The Short Channel MOSFET
  • Double Gate MOSFET and FinFETs

Learning Outcomes

  • Understand different modes of operation of a metal-oxide-semiconductor (MOS) system.
  • Draw and understand the energy band diagram MOS system under different bias arrangements.
  • Extend the understanding of MOS capacitors to realize MOS field effect transistors (MOSFETs).
  • Derive current voltage relationships of n-channel and p-channel MOSFETs.
  • Understand the challenges associated with reducing the size of MOSFETS.
  • Understand the operating principle of bipolar junction transistors, draw their energy band diagram, minority and majority carrier concentrations and the process of carrier transport.
  • Understand the semiconductor device operation in photo regime, including light emitting diodes as well as photo detectors.
  • Understand design principle and operation of advanced architectures like fin gated FETs, and nanowire FETs.
  • Understand the operating principle of next generation device technologies, including, graphene and carbon nanotube based FETs, and 2-D material based transistors. Students will be able to link the material physics to transistor design.

  • Device TCAD and Device Design Basics using TCAD
  • CMOS Process Technology, Process Development, Integration and Simulation
  • Semiconductor Device Characterization
  • Library / PDK Development
  • Includes hands-on projects at MSDLab during 5-day visit to IISc campus

Learning Outcomes

  • The participants will be able to know the device simulation using industry standard TCAD tool and relate the theoretical concepts with the help of simulation experiments. They will also be able to answer the importance of the TCAD tool for device designing.
  • They will be able to perform basic 2D simulation of the basic devices like Resistor, Diode, MOSFET.
  • At the end of this module, the participants will also be able know the process recipe to fabricate basic device structures. They will be able to know the realization of the semiconductor devices using basic process steps like; depositing oxide screening, implantation and annealing.
  • With the help of lab, they will be able to analyse the charge transport phenomenon to develop device level understanding and how these charge transports impacts on the electrical characteristics of the devices.
  • At the end they will be able to do circuit simulation with the semiconductor devices using MIXMODE simulation, where they can relate how NMOS and PMOS can be design in device level to get the optimum characteristics of the inverter.
  • They will also be able to taste the real scenario of the semiconductor devices. How these devices can be fabricated and characterized in Lab by visiting at MSD’s Lab, IISc.

Apply Now

Download Brochure

Find out why professionals want to join
this programme

  • "I am interested in Microelectronics and Semiconductor Technologies for its focus on high-performance microchips used in daily devices. The esteemed course at IISc will equip me with the necessary skills to contribute to this growing field."
    Fresher from an academic institute of applied science
  • "I have 15+ years of experience as an Electrical & Instrumentation Specialist. I now seek academic depth and sophistication, which the PG Level Advanced Certification Program in Microelectronics and Semiconductor Technologies at IISc can provide in the field of semiconductors."
    Quality Assurance at a leading semiconductor company
  • "I have 8+ years of experience in SOC validation and am eager to expand my knowledge in semiconductors. This comprehensive program will help me gain more expertise and improve my technical skills/capabilities, allowing me to meet industry demands and advance in my career."
    Senior Engineer with 7+ years
    of experience

Note: These are edited versions based on the details submitted by various programme applicants.

High Impact Learning

Our program offers two distinct tracks, each tailored to meet
different needs and goals.

  • 9 months comprehensive programme
    PG Level Advanced Certification
    Programme in Microelectronics and Semiconductor Technologies 5 Days Campus Visit Hands on Project at MSDLab Apply Now
  • 6 months
    programme
    Advanced Certification Programme in Microelectronics and Semiconductor Technologies 2 Days Campus Visit Visit to MSDLab Apply Now

Preview of MSDLab at IISc

Is this programme ideal for me?

  • A tech professional in semiconductor/VLSI domain, or across any electronics industry, keen to build expertise in design, development, and integration of micro and nanoelectronics devices and semiconductor technologies.
  • An industry professional willing to build a leadership career in the semiconductor industry.
  • A fresh graduate willing to build a career in Microelectronics & semiconductor industry.

Eligibility

Minimum Qualification: B.E./B.Tech Degree (ECE, EEE, EE, Instrumentation, Nanoscience/Nanotechnology, Material Science, Material Physics, Material Engineering and Semiconductor)

How do I Enrol in this Programme?

It’s a simple 4-step process

  • Apply for
    programme
  • Submit
    details
  • Await
    selection
  • Join
    programme

*Scanned copies of the education certificate to be submitted within 7 days.

**Selection for the programme will be done by IISc and is strictly based on the education, work experience, and motivation of the participants.

What is the return on my investment?

Supercharge your professional growth

  • Master the art of designing and fabricating cutting-edge semiconductor devices

  • Innovate electronics and electrical products that seamlessly integrate machines, workers, energy, material, and data

Empower your organization to lead
the semiconductor frontier

  • Build and foster a team capable of designing and bringing to life nano-scale semiconductor devices

What is My Investment?

9 months comprehensive programme

PG Level Advanced Certification Programme in Microelectronics and Semiconductor Technologies

Fee: ₹3,00,000

Lab Fee: ₹50,000

Flexible EMI Options starting at
₹20,978 / Month

6 months programme

Advanced Certification Programme in Microelectronics and Semiconductor Technologies

Fee: ₹2,00,000

Lab Fee: ₹50,000

Flexible EMI Options starting at
₹18,356 / Month

Scholarships Available

  • (i) Application Fee of ₹2,000, and
  • (ii) Campus visit fee will be based on actuals and to be borne by the participants.
  • (iii) Fees paid are non-refundable and non-transferable.

Programme Media Coverage

About TalentSprint

Frequently Asked Questions

Microelectronics and Semiconductor Technologies are enabling the creation of next-generation semiconductors, making systems faster, smaller and more energy efficient. With possibilities to improve and even revolutionize many technologies, Microelectronics is delivering immense value to IT, medicine, transportation, energy, food safety, environmental science, and many others. Some of the important developments listed here indicate the accelerating Microelectronics and semiconductor technologies industry growth.

  • Worldwide semiconductor revenue is expected to reach $661 billion in 2022, a 13.7% Y-o-Y growth rate. (~ International Data Corporation)
  • "India is poised to be the second largest market in the world in terms of scale and growing demand for semiconductor components across several industries and applications." (~ India Semiconductor Market Report, 2019-2026)
  • The semiconductor decade will witness 70% of growth driven by automotive, data storage, and wireless industries. (~Mckinsey)
  • With rapid innovation and global production shifting from the USA and Europe to Asia, this sector is creating tremendous opportunities for professionals and entrepreneurs, especially in Asian countries like India, Taiwan, South Korea, Japan and China.

This is the right time for professionals to gain a deep insight into designing, modeling, characterisation and development of semiconductor technology and tap into the promising opportunities that this sector offers.

The majority of professionals in the VLSI and semiconductor industry are often trained in VLSI design or circuit design principles, and in their design practice, they consider semiconductor devices as a black box. These design practices, which require one to follow thousands of design rules, don’t involve a first principal understanding of semiconductor technology.

This gap originates from the undergraduate and postgraduate training given at the majority of places, which lacks rigorous training on micro and nanoelectronics and device as well as semiconductor technology principles. While the black box approach may have worked for several generations, given the way technology is advancing, it is going to be difficult for working professionals to survive in this industry without understanding the fundamentals of devices and semiconductor technologies and the principles of micro and nanoelectronics.

The other aspect is the push for semiconductor fabs and production around the world. There will be around fifty new fabs in the next 5 years, possibly even more, and each fab would require thousands of semiconductor professionals. This means there will be demand for over one lakh new professionals in the next five years who understand semiconductor technologies. To enable professionals to navigate this change, IISc, in association with TalentSprint, has launched this online programme, where aspirants can enhance their knowledge and build capabilities to thrive in the new semiconductor era.

IISc offers India’s most sought-after M-Tech programme on Microelectronics and Semiconductor Technologies and VLSI Design. This programme is jointly designed and delivered by the Department of Electronics Systems Engineering and the Department of Electrical and Communications Engineering. A majority of the top GATE-scoring candidates apply for this programme. It offers research-oriented training curated from the expert industry and research experiences. What professionals will learn during this PG Level Advanced Certification Programme is a significant subset of what is covered in IISc’s regular M-Tech programme.

This LIVE and interactive online programme has the potential to strengthen fundamentals, inform new industry developments and bridge the knowledge gap. Participants attending this programme can benefit from the following -

IISc Advantage
  • Designed by the Department of Electronic Systems Engineering, IISc
  • Taught by top researchers in Microelectronics and Semiconductor Technologies
  • Access to the MSDLabs
  • Globally recognised certificate from IISc, ndia's #1 University and #1 Research Institute*
Cutting-edge Applied Learning
  • Experiential Learning supported by use-cases and hands on project at MSDLab
  • Hands-on curriculum for effective learning by practitioners
  • Opportunity to implement your projects in state-of-the-art research labs
  • Industry interactions with semiconductor technology leaders
Career Impact
  • Showcase your expertise through projects and experiments
  • Network with current and future leaders of microelectronics and semiconductor
  • Upgrade your technical profile with a top certification
TalentSprint Advantage
  • Learn on TalentSprint’s patent-pending Digital Platform
  • Network with 3000+ TalentSprint Deep Tech Alumni
  • Access TalentSprint Career Accelerator
*As per NIRF Ranking 2023

  • Working professionals in the VLSI and Electronics Industry, as well as Electronic Design Automation (EDA) Industry.
  • Tech Professionals in the semiconductor domain, keen to build expertise in the design, development, or integration of Microelectronics and semiconductor technologies.
  • Recent graduates or master’s students across the globe.

  • Prepares professionals for the current and next-gen semiconductor age while ensuring their development of state-of-the-art industry standards and practical knowledge.
  • Professionals can establish themselves as leaders in the rapidly evolving semiconductor and VLSI industry while acquiring technologically challenging positions worldwide.
  • Professionals can benefit from a curriculum curated by combing decades of research experience, industry acumen, and technology development experience, limited to a very few experts around the world.
  • Earn an Executive Programme Certificate from the IISc upon completion of the programme.
  • Network and associate with other semiconductor industry professionals.

View All